When Sunmmio showcased A4E 3D stacked chip, it compared 2D to 2.5D to 3D.

Common 2.5D AI chip packaging is TSMC CoWoS binds GPU-HBM on a microscopic interposer for improved speed. 3D Through-Silicon Via/TSVs shorten interconnect length & increase bandwidth bw memory & logic. https://t.co/UgTY678I1v — via @tphuang

3D chip comparison highlights TSV bandwidth gains vs CoWoS, driving AI packaging interest.