I DID SOME LOWER BOUND MAFS (H/T @JUKAN05, @ZEPHYR_Z9). 950 LOGIC DIES ARE ≤430MM^2, 2 PER NPU. TSMC HAD 0.09 DEFECTS/CM^2 IN 2019, ON 7NM DUV. ASSUME SMIC IS >3X WORSE STILL. 30% YIELD, 20 NPUS/WA

I DID SOME LOWER BOUND MAFS (H/T @JUKAN05, @ZEPHYR_Z9). 950 LOGIC DIES ARE ≤430MM^2, 2 PER NPU. TSMC HAD 0.09 DEFECTS/CM^2 IN 2019, ON 7NM DUV. ASSUME SMIC IS >3X WORSE STILL. 30% YIELD, 20 NPUS/WAFER. 600K WAFERS/YEAR, LET'S SAY 50% AI ALLOCATION. 6 MILLION NPUS, MAYBE 6 GW. HTTPS://T.CO/GC0WDQ4BVA — VIA @TEORTAXESTEX

High-priority alert based on source significance and keyword relevance.