The quiet threat to Besi: ASML's patent filings and roadmap point to a hybrid bonding tool. The track design could give ASML an edge in alignment and particle control, the two factors that set bonding

What happened: ASML has not announced a hybrid bonding tool, but patent filings, a news report and its roadmap point to a die-to-wafer (D2W) bonder that moves single dies on independent holders around a track. Key numbers: 27 bonding patent families filed December 2022 to November 2024; TSMC SoIC bonds at about 6um pitch today, targets 4.5um Why it matters: The report sees the move as a natural extension of ASML's vertical integration that could strengthen customer ties, and calls it bad news for Besi, which leads D2W and holds most of its hybrid bonding business in logic at TSMC and Intel.

ASML has not announced a hybrid bonding tool, but patent filings, a news report and its roadmap point to a die-to-wafer (D2W) bonder that moves single dies on independent holders around a track.

The report sees the move as a natural extension of ASML's vertical integration that could strengthen customer ties, and calls it bad news for Besi, which leads D2W and holds most of its hybrid bonding business in logic at TSMC and Intel.