UMC AND AP MEMORY COLLABORATE TO ENABLE ADVANCED POWER DELIVERY SOLUTIONS FOR AI AND HPC SYSTEMS

What happened: UMC and AP Memory announced a technology and manufacturing collaboration to advance power delivery solutions for AI and HPC systems, combining UMC's deep trench capacitor foundry technology with AP Memory's silicon capacitor designs. Key numbers: AP Memory's S-SiCap Gen2D designs completed tape-out and initial functional validation in Q3 2026. Why it matters: UMC said AI and HPC growth is shifting power delivery from board-level toward vertical power integration at chip level, and the partners aim to address power efficiency challenges in next-generation data centers.

UMC and AP Memory announced a technology and manufacturing collaboration to advance power delivery solutions for AI and HPC systems, combining UMC's deep trench capacitor foundry technology with AP Memory's silicon capacitor designs.

UMC said AI and HPC growth is shifting power delivery from board-level toward vertical power integration at chip level, and the partners aim to address power efficiency challenges in next-generation data centers.