TSMC to raise advanced chip packaging prices by up to 20%, report says

What happened: TSMC is set to raise prices for advanced chip packaging services by as much as 20%, per the Commercial Times, citing industry sources, as AI demand tightens capacity. Key numbers: CoWoS price increases of 10% to 20%. Equipment lead times lengthened to six to eight months from three to six. CoWoS monthly capacity expected to exceed 130,000 wafers in 2026 and reach 200,000 in 2027. Why it matters: The report says demand has spread from GPUs to server CPUs and custom ASICs, while longer AI chip testing times add pressure on packaging and testing capacity. Market: +1.4% today ($424.37), +33.5% YTD, 0.8x vol — as of 22:46 UTC

TSMC is set to raise prices for advanced chip packaging services by as much as 20%, per the Commercial Times, citing industry sources, as AI demand tightens capacity.

The report says demand has spread from GPUs to server CPUs and custom ASICs, while longer AI chip testing times add pressure on packaging and testing capacity. Market: +1.4% today ($424.37), +33.5% YTD, 0.8x vol — as of 22:46 UTC