NECESSITY IS THE MOTHER OF INNOVATION.

IN ONE FELL SWOOP, HUAWEI OVERTAKES ALL IN ADVANCED HYBRID BONDING TECHNOLOGY, WITH 2026 KIRIN SMARTPHONES FEATURING 1.5 ΜM BOND PITCH 3D-STACKED ARCHITECTURE. NEXT YEAR'S KIRIN CHIPS WILL GO DOWN 1 ΜM PITCH! TSMC HAS ONLY JUST MOVED TO 6 ΜM SOIC, WITH THEIR NEXT STEP TO 4.5 ΜM FOR 2030 PRODUCTS. INTEL'S FOVEROS DIRECT IS AT 9 ΜM WITH CLEARWATER FOREST THIS YEAR. 16-36X DENSER INTERCONNECT ENABLES HUAWEI'S LOGICFOLDING DESIGN, WITH MORE GRANULAR ARCHITECTUR

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