NECESSITY IS THE MOTHER OF INNOVATION.

NECESSITY IS THE MOTHER OF INNOVATION. IN ONE FELL SWOOP, HUAWEI OVERTAKES ALL IN ADVANCED HYBRID BONDING TECHNOLOGY, WITH 2026 KIRIN SMARTPHONES FEATURING 1.5 ΜM BOND PITCH 3D-STACKED ARCHITECTURE. NEXT YEAR'S KIRIN CHIPS WILL GO DOWN 1 ΜM PITCH! TSMC HAS ONLY JUST MOVED TO 6 ΜM SOIC, WITH THEIR NEXT STEP TO 4.5 ΜM FOR 2030 PRODUCTS. INTEL'S FOVEROS DIRECT IS AT 9 ΜM WITH CLEARWATER FOREST THIS YEAR. 16-36X DENSER INTERCONNECT ENABLES HUAWEI'S LOGICFOLDING DESIGN, WITH MORE GRANULAR ARCHITECTUR

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